23930350M05
SKiM609GAR12E4-M05
SKIM 93, HPTP
23930350M05
Product specifications
Characteristic | Value |
|---|---|
| Chip technology | IGBT 4 (Trench) |
| Country of origin | Germany |
| Current (A) | 600 A |
| Dimensions (LxWxH) | 160x150x35 |
| Features | IGBT 4 Trench Gate TechnologySolderless sinter technologyV<sub>CE(sat)</sub> with positive temperature coefficientLow inductance caseInsulated by Al<sub>2</sub>O<sub>3</sub> DBC (Direct Bonded Copper) ceramic substratePressure contact technology for thermal contactsSpring contact system to attach driver PCB to the control terminalsHigh short circuit capability, self limiting to 6 x I<sub>C</sub>Integrated temperature sensor |
| Housing | SKIM 93 |
| Product line | SKiM 93 |
| Product Status | In Production New |
| Technology | IGBT |
| Topology | Chopper/Booster |
| Type | SKIM 93 |
| Typical applications | Automotive inverterHigh reliability AC inverter windHigh reliability AC inverter drives |
| Variant | HPTP |
| Variant Description | The SKiM609GAR12E4-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + High Performance Thermal Paste (HPTP) |
| Voltage (V) | 1200 V |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 1.2 Kilogram |
| Net weight | 1.1 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |