Semikron Danfoss logo

25241220M25

SKiiP39GB12VV1-M25

MiniSKiiP II 3, Standard lid and HPTP

Product specifications

Characteristic
Value
Chip technologyV-IGBT
Country of originGermany
Current (A)400 A
Dimensions (LxWxH)82x59x16
FeaturesRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
HousingMiniSKiiP II 3
Product lineMiniSKiiP
Product StatusIn Production New
TechnologyIGBT
TopologyHalf-Bridge
TypeMiniSKiiP II 3
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP39GB12VV1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.098 Kilogram
Net weight0.08 Kilogram
Proposition 65Cancer and Reproductive Harm