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25232780M25

SKiiP 39TMLI12T4V2-M25

MiniSKiiP II 3, Standard lid and HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 4 (Trench)
Country of originGermany
Current (A)200 A
Dimensions (LxWxH)82x59x16
FeaturesRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532
HousingMiniSKiiP II 3
Product lineMiniSKiiP
Product StatusIn Production New
TechnologyIGBT
Topology3-Level
TypeMiniSKiiP II 3
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 39TMLI12T4V2-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm