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Semikron Danfoss Standard Photo MiniSKiiP II 3

25233300M15

SKiiP 38NAB12RAV1-M15

MiniSKiiP II 3, Slim lid and HPTP

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originChinaSlovakiaGermany
Current (A)100 A
Voltage (V)1200 V
TopologyCIB
Product lineMiniSKiiP
HousingMiniSKiiP II 3
Dimensions (LxWxH)82x59x16
TechnologyIGBT
Chip technologyRGA
Features1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyNew SKR PEP diode technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram

Variant information

Characteristic
Value
VariantSlim lid and HPTP
Variant DescriptionThe SKiiP 38NAB12RAV1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-38nab12rav1-m01-25233300m01">SKiiP 38NAB12RAV1-M01</a><a href="/products/p/skiip-38nab12rav1-m15-25233300m15">SKiiP 38NAB12RAV1-M15</a><a href="/products/p/skiip-38nab12rav1-m20-25233300m20">SKiiP 38NAB12RAV1-M20</a><a href="/products/p/skiip-38nab12rav1-m25-25233300m25">SKiiP 38NAB12RAV1-M25</a>