25240719M25
SKiiP 38GB07E3V1-M25
MiniSKiiP II 3, Standard lid and HPTP
25240719M25
Product specifications
Characteristic | Value |
|---|---|
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Germany |
| Current (A) | 300 A |
| Dimensions (LxWxH) | 82x59x16 |
| Features | 650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor |
| Housing | MiniSKiiP II 3 |
| Product line | MiniSKiiP |
| Product Status | In Production New |
| Technology | IGBT |
| Topology | Half-Bridge |
| Type | MiniSKiiP II 3 |
| Variant | Standard lid and HPTP |
| Variant Description | The SKiiP 38GB07E3V1-M25 is a 650 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content. |
| Variant Short Description | Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP) |
| Voltage (V) | 650 V |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.1 Kilogram |
| Net weight | 0.082 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |