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Semikron Danfoss Standard Photo MiniSKiiP II 3

25232760M25

SKiiP 38AC176V2-M25

MiniSKiiP II 3, Standard lid and HPTP

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originGermany
Current (A)100 A
Voltage (V)1700 V
TopologySixpack
Product lineMiniSKiiP
HousingMiniSKiiP II 3
Dimensions (LxWxH)82x59x16
TechnologyIGBT
Chip technologyIGBT 3 (Trench)
FeaturesTrench IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532NTC T-Sensor

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 38AC176V2-M25 is a 1700 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-38ac176v2-m00-25232760m00">SKiiP 38AC176V2-M00</a><a href="/products/p/skiip-38ac176v2-m05-25232760m05">SKiiP 38AC176V2-M05</a><a href="/products/p/skiip-38ac176v2-m15-25232760m15">SKiiP 38AC176V2-M15</a><a href="/products/p/skiip-38ac176v2-m20-25232760m20">SKiiP 38AC176V2-M20</a><a href="/products/p/skiip-38ac176v2-m21-25232760m21">SKiiP 38AC176V2-M21</a><a href="/products/p/skiip-38ac176v2-m25-25232760m25">SKiiP 38AC176V2-M25</a>