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Semikron Danfoss Standard Photo MiniSKiiP II 3

25232380M01

SKiiP 37ACC12T7V1-M01

MiniSKiiP II 3, Wacker P12

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originGermany
Current (A)75 A
Voltage (V)1200 V
TopologyTwelvepack
Product lineMiniSKiiP
HousingMiniSKiiP II 3
Dimensions (LxWxH)82x59x16
TechnologyIGBT
Chip technologyIGBT T7
Features1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantWacker P12
Variant DescriptionThe SKiiP 37ACC12T7V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Variant Short DescriptionModule + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-37acc12t7v1-m01-25232380m01">SKiiP 37ACC12T7V1-M01</a><a href="/products/p/skiip-37acc12t7v1-m15-25232380m15">SKiiP 37ACC12T7V1-M15</a><a href="/products/p/skiip-37acc12t7v1-m20-25232380m20">SKiiP 37ACC12T7V1-M20</a><a href="/products/p/skiip-37acc12t7v1-m25-25232380m25">SKiiP 37ACC12T7V1-M25</a>