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Semikron Danfoss Standard Photo MiniSKiiP II 3

25231160M25

SKiiP 37AC12T7V1-M25

MiniSKiiP II 3, Standard lid and HPTP

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originChinaGermany
Current (A)75 A
Voltage (V)1200 V
TopologySixpack
Product lineMiniSKiiP
HousingMiniSKiiP II 3
Dimensions (LxWxH)82x59x16
TechnologyIGBT
Chip technologyIGBT T7
Features1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 37AC12T7V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-37ac12t7v1-m01-25231160m01">SKiiP 37AC12T7V1-M01</a><a href="/products/p/skiip-37ac12t7v1-m05-25231160m05">SKiiP 37AC12T7V1-M05</a><a href="/products/p/skiip-37ac12t7v1-m15-25231160m15">SKiiP 37AC12T7V1-M15</a><a href="/products/p/skiip-37ac12t7v1-m20-25231160m20">SKiiP 37AC12T7V1-M20</a><a href="/products/p/skiip-37ac12t7v1-m25-25231160m25">SKiiP 37AC12T7V1-M25</a>