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Semikron Danfoss Standard Photo MiniSKiiP II 3

25233020M25

SKiiP 37AC12F4V1-M25

MiniSKiiP II 3, Standard lid and HPTP

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originChinaGermany
Current (A)75 A
Voltage (V)1200 V
TopologySixpack
Product lineMiniSKiiP
HousingMiniSKiiP II 3
Dimensions (LxWxH)82x59x16
TechnologyIGBT
Chip technologyIGBT 4 Fast (Trench)
FeaturesIGBT4 FastRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 37AC12F4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-37ac12f4v1-m01-25233020m01">SKiiP 37AC12F4V1-M01</a><a href="/products/p/skiip-37ac12f4v1-m20-25233020m20">SKiiP 37AC12F4V1-M20</a><a href="/products/p/skiip-37ac12f4v1-m25-25233020m25">SKiiP 37AC12F4V1-M25</a>