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Semikron Danfoss Standard Photo MiniSKiiP II 3

25231050M01

SKiiP 35NAC12F4V1-M01

MiniSKiiP II 3, Wacker P12

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Product specifications

Characteristic
Value
Current (A)50 A
Voltage (V)1200 V
TopologyCI
HousingMiniSKiiP II 3
Chip technologyIGBT 4 Fast (Trench)
Country of originChinaGermany
Dimensions (LxWxH)82x59x16
FeaturesFast Trench 4 IGBTsRobust and soft switching diodes in CAL technologyNEW SKR PEP diode-technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
Product lineMiniSKiiP
Product StatusIn Production New
TechnologyIGBT
VariantWacker P12

General specifications

Characteristic
Value
Gross weight0.1 Kilogram
Net weight0.082 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
Variant DescriptionThe SKiiP 35NAC12F4V1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness
Variant Short DescriptionModule + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-35nac12f4v1-m01-25231050m01">SKiiP 35NAC12F4V1-M01</a><a href="/products/p/skiip-35nac12f4v1-m20-25231050m20">SKiiP 35NAC12F4V1-M20</a><a href="/products/p/skiip-35nac12f4v1-m25-25231050m25">SKiiP 35NAC12F4V1-M25</a>