Semikron Danfoss logo
Semikron Danfoss Standard Photo MiniSKiiP II 2

25232830M25

SKiiP 29TMLI12F4V1-M25

MiniSKiiP II 2, Standard lid and HPTP

*Account required

Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originGermany
Current (A)150 A
Voltage (V)1200 V
Topology3-Level
Product lineMiniSKiiP
HousingMiniSKiiP II 2
Dimensions (LxWxH)59x52x16
TechnologyIGBT
Chip technologyIGBT 4 Fast (Trench)
FeaturesFast Trench 4 IGBTsTrench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 29TMLI12F4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-29tmli12f4v1-m00-25232830m00">SKiiP 29TMLI12F4V1-M00</a><a href="/products/p/skiip-29tmli12f4v1-m15-25232830m15">SKiiP 29TMLI12F4V1-M15</a><a href="/products/p/skiip-29tmli12f4v1-m20-25232830m20">SKiiP 29TMLI12F4V1-M20</a><a href="/products/p/skiip-29tmli12f4v1-m21-25232830m21">SKiiP 29TMLI12F4V1-M21</a><a href="/products/p/skiip-29tmli12f4v1-m25-25232830m25">SKiiP 29TMLI12F4V1-M25</a>

General specifications

Characteristic
Value
Gross weight0.06 Kilogram
Net weight0.055 Kilogram
Proposition 65Cancer and Reproductive Harm