25233630M01
SKiiP 27AC12RAV1-M01
MiniSKiiP II 2, Wacker P12
25233630M01
Product specifications
Characteristic | Value |
|---|---|
| Current (A) | 75 A |
| Voltage (V) | 1200 V |
| Topology | Sixpack |
| Housing | MiniSKiiP II 2 |
| Chip technology | RGA |
| Country of origin | Germany |
| Dimensions (LxWxH) | 59x52x16 |
| Features | 1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532 |
| Product line | MiniSKiiP |
| Product Status | In Production New |
| Technology | IGBT |
| Variant | Wacker P12 |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.07 Kilogram |
| Net weight | 0.065 Kilogram |
Variant information
Characteristic | Value |
|---|---|
| Variant Description | The SKiiP 27AC12RAV1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness |
| Variant Short Description | Module + Thermal Paste Wacker P12 |
| Variants | <a href="/products/p/skiip-27ac12rav1-m01-25233630m01">SKiiP 27AC12RAV1-M01</a><a href="/products/p/skiip-27ac12rav1-m20-25233630m20">SKiiP 27AC12RAV1-M20</a><a href="/products/p/skiip-27ac12rav1-m25-25233630m25">SKiiP 27AC12RAV1-M25</a> |