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Semikron Danfoss Standard Photo MiniSKiiP II 2 GB

25241223M25

SKiiP 26GB12F4V1-M25

MiniSKiiP II 2, Standard lid and HPTP

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originGermany
Current (A)200 A
Voltage (V)1200 V
TopologyHalf-Bridge
Product lineMiniSKiiP
HousingMiniSKiiP II 2
Dimensions (LxWxH)59x52x16
TechnologyIGBT
Chip technologyIGBT 4 Fast (Trench)
FeaturesFast Trench 4 IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor

General specifications

Characteristic
Value
Gross weight0.06 Kilogram
Net weight0.055 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 26GB12F4V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-26gb12f4v1-m20-25241223m20">SKiiP 26GB12F4V1-M20</a><a href="/products/p/skiip-26gb12f4v1-m25-25241223m25">SKiiP 26GB12F4V1-M25</a>