Semikron Danfoss logo
Semikron Danfoss Standard Photo MiniSKiiP II 2 GB

25240715M01

SKiiP 26GB07E3V1-M01

MiniSKiiP II 2, Wacker P12

*Account required

Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originGermany
Current (A)200 A
Voltage (V)650 V
TopologyHalf-Bridge
Product lineMiniSKiiP
HousingMiniSKiiP II 2
Dimensions (LxWxH)59x52x16
TechnologyIGBT
Chip technologyIGBT 3 (Trench)
Features650V Trench IGBTsRobust and soft diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised: File no. E63532NTC T-Sensor
VariantWacker P12
Variant DescriptionThe SKiiP 26GB07E3V1-M01 is a 650 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Variant Short DescriptionModule + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-26gb07e3v1-m00-25240715m00">SKiiP 26GB07E3V1-M00</a><a href="/products/p/skiip-26gb07e3v1-m01-25240715m01">SKiiP 26GB07E3V1-M01</a><a href="/products/p/skiip-26gb07e3v1-m10-25240715m10">SKiiP 26GB07E3V1-M10</a><a href="/products/p/skiip-26gb07e3v1-m11-25240715m11">SKiiP 26GB07E3V1-M11</a><a href="/products/p/skiip-26gb07e3v1-m20-25240715m20">SKiiP 26GB07E3V1-M20</a><a href="/products/p/skiip-26gb07e3v1-m21-25240715m21">SKiiP 26GB07E3V1-M21</a><a href="/products/p/skiip-26gb07e3v1-m25-25240715m25">SKiiP 26GB07E3V1-M25</a>

General specifications

Characteristic
Value
Gross weight0.06 Kilogram
Net weight0.055 Kilogram
Proposition 65Cancer and Reproductive Harm