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Semikron Danfoss Standard Photo MiniSKiiP II 2

25233680M05

SKiiP 25NAB12RAV1-M05

MiniSKiiP II 2, HPTP

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originChinaSlovakiaGermany
Current (A)50 A
Voltage (V)1200 V
TopologyCIB
Product lineMiniSKiiP
HousingMiniSKiiP II 2
Dimensions (LxWxH)59x52x16
TechnologyIGBT
Chip technologyRGA
Features1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyNew SKR PEP diode technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

General specifications

Characteristic
Value
Gross weight0.06 Kilogram
Net weight0.055 Kilogram

Variant information

Characteristic
Value
VariantHPTP
Variant DescriptionThe SKiiP 25NAB12RAV1-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-25nab12rav1-m01-25233680m01">SKiiP 25NAB12RAV1-M01</a><a href="/products/p/skiip-25nab12rav1-m05-25233680m05">SKiiP 25NAB12RAV1-M05</a><a href="/products/p/skiip-25nab12rav1-m15-25233680m15">SKiiP 25NAB12RAV1-M15</a><a href="/products/p/skiip-25nab12rav1-m20-25233680m20">SKiiP 25NAB12RAV1-M20</a><a href="/products/p/skiip-25nab12rav1-m25-25233680m25">SKiiP 25NAB12RAV1-M25</a>