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Semikron Danfoss Standard Photo MiniSKiiP II 2

25233330M01

SKiiP 25AC12RAV1-M01

MiniSKiiP II 2, Wacker P12

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Product specifications

Characteristic
Value
Current (A)50 A
Voltage (V)1200 V
TopologySixpack
HousingMiniSKiiP II 2
Chip technologyRGA
Country of originGermany
Dimensions (LxWxH)59x52x16
Features1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
Product lineMiniSKiiP
Product StatusIn Production New
TechnologyIGBT
VariantWacker P12

General specifications

Characteristic
Value
Gross weight0.07 Kilogram
Net weight0.065 Kilogram

Variant information

Characteristic
Value
Variant DescriptionThe SKiiP 25AC12RAV1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness
Variant Short DescriptionModule + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-25ac12rav1-m01-25233330m01">SKiiP 25AC12RAV1-M01</a><a href="/products/p/skiip-25ac12rav1-m15-25233330m15">SKiiP 25AC12RAV1-M15</a><a href="/products/p/skiip-25ac12rav1-m20-25233330m20">SKiiP 25AC12RAV1-M20</a><a href="/products/p/skiip-25ac12rav1-m25-25233330m25">SKiiP 25AC12RAV1-M25</a>