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Semikron Danfoss Standard Photo MiniSKiiP II 2

25232110M15

SKiiP 23NAB12T4V2-M15

MiniSKiiP II 2, Slim lid and HPTP

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originGermany
Current (A)25 A
Voltage (V)1200 V
TopologyCIB
Product lineMiniSKiiP
HousingMiniSKiiP II 2
Dimensions (LxWxH)59x52x16
TechnologyIGBT
Chip technologyIGBT 4 (Trench)
FeaturesTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

General specifications

Characteristic
Value
Gross weight0.06 Kilogram
Net weight0.055 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantSlim lid and HPTP
Variant DescriptionThe SKiiP 23NAB12T4V2-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-23nab12t4v2-m01-25232110m01">SKiiP 23NAB12T4V2-M01</a><a href="/products/p/skiip-23nab12t4v2-m10-25232110m10">SKiiP 23NAB12T4V2-M10</a><a href="/products/p/skiip-23nab12t4v2-m15-25232110m15">SKiiP 23NAB12T4V2-M15</a><a href="/products/p/skiip-23nab12t4v2-m20-25232110m20">SKiiP 23NAB12T4V2-M20</a><a href="/products/p/skiip-23nab12t4v2-m25-25232110m25">SKiiP 23NAB12T4V2-M25</a>