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Semikron Danfoss Standard Photo MiniSKiiP II 2

25231960M15

SKiiP 23ACC12T7V1-M15

MiniSKiiP II 2, Slim lid and HPTP

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originGermany
Current (A)25 A
Voltage (V)1200 V
TopologyTwelvepack
Product lineMiniSKiiP
HousingMiniSKiiP II 2
Dimensions (LxWxH)59x52x16
TechnologyIGBT
Chip technologyIGBT T7
Features1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

General specifications

Characteristic
Value
Gross weight0.07 Kilogram
Net weight0.065 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantSlim lid and HPTP
Variant DescriptionThe SKiiP 23ACC12T7V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-23acc12t7v1-m01-25231960m01">SKiiP 23ACC12T7V1-M01</a><a href="/products/p/skiip-23acc12t7v1-m10-25231960m10">SKiiP 23ACC12T7V1-M10</a><a href="/products/p/skiip-23acc12t7v1-m15-25231960m15">SKiiP 23ACC12T7V1-M15</a><a href="/products/p/skiip-23acc12t7v1-m20-25231960m20">SKiiP 23ACC12T7V1-M20</a><a href="/products/p/skiip-23acc12t7v1-m25-25231960m25">SKiiP 23ACC12T7V1-M25</a>