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Semikron Danfoss Standard Photo MiniSKiiP II 1

25238300M25

SKiiP 14NAB066V2-M25

MiniSKiiP II 1, Standard lid and HPTP

Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originChinaGermany
Current (A)20 A
Voltage (V)600 V
TopologyCIB
Product lineMiniSKiiP
HousingMiniSKiiP II 1
Dimensions (LxWxH)42x40x16
TechnologyIGBT
Chip technologyIGBT 3 (Trench)
FeaturesTrench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532

General specifications

Characteristic
Value
Gross weight0.04 Kilogram
Net weight0.03 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 14NAB066V2-M25 is a 600 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-14nab066v2-m01-25238300m01">SKiiP 14NAB066V2-M01</a><a href="/products/p/skiip-14nab066v2-m20-25238300m20">SKiiP 14NAB066V2-M20</a><a href="/products/p/skiip-14nab066v2-m25-25238300m25">SKiiP 14NAB066V2-M25</a>