25233600M25
SKiiP 13AC12RAV1-M25
MiniSKiiP II 1, Standard lid and HPTP
25233600M25
Product specifications
Characteristic | Value |
|---|---|
| Current (A) | 25 A |
| Voltage (V) | 1200 V |
| Topology | Sixpack |
| Housing | MiniSKiiP II 1 |
| Chip technology | RGA |
| Country of origin | Germany |
| Dimensions (LxWxH) | 42x40x16 |
| Features | 1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532 |
| Product line | MiniSKiiP |
| Product Status | In Production New |
| Technology | IGBT |
| Variant | Standard lid and HPTP |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.04 Kilogram |
| Net weight | 0.03 Kilogram |
Variant information
Characteristic | Value |
|---|---|
| Variant Description | The SKiiP 13AC12RAV1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP) |
| Variants | <a href="/products/p/skiip-13ac12rav1-m01-25233600m01">SKiiP 13AC12RAV1-M01</a><a href="/products/p/skiip-13ac12rav1-m20-25233600m20">SKiiP 13AC12RAV1-M20</a><a href="/products/p/skiip-13ac12rav1-m25-25233600m25">SKiiP 13AC12RAV1-M25</a> |