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Semikron Danfoss Standard Photo MiniSKiiP II 1

25231210M25

SKiiP 13AC126V20-M25

MiniSKiiP II 1, Standard lid and HPTP

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Product specifications

Characteristic
Value
Product StatusIn Production
Country of originGermany
Current (A)25 A
Voltage (V)1200 V
TopologySixpack
Product lineMiniSKiiP
HousingMiniSKiiP II 1
Dimensions (LxWxH)42x40x16
TechnologyIGBT
Chip technologyIGBT 3 (Trench)
FeaturesFast Trench IGBT´sRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 13AC126V20-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/skiip-13ac126v20-m00-25231210m00">SKiiP 13AC126V20-M00</a><a href="/products/p/skiip-13ac126v20-m10-25231210m10">SKiiP 13AC126V20-M10</a><a href="/products/p/skiip-13ac126v20-m20-25231210m20">SKiiP 13AC126V20-M20</a><a href="/products/p/skiip-13ac126v20-m01-25231210m01">SKiiP 13AC126V20-M01</a><a href="/products/p/skiip-13ac126v20-m11-25231210m11">SKiiP 13AC126V20-M11</a><a href="/products/p/skiip-13ac126v20-m21-25231210m21">SKiiP 13AC126V20-M21</a><a href="/products/p/skiip-13ac126v20-m25-25231210m25">SKiiP 13AC126V20-M25</a>

General specifications

Characteristic
Value
Gross weight0.04 Kilogram
Net weight0.03 Kilogram
Proposition 65Cancer and Reproductive Harm