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25231210M11

SKiiP 13AC126V20-M11

MiniSKiiP II 1, Slim lid and Wacker P12

Product specifications

Characteristic
Value
Chip technologyIGBT 3 (Trench)
Country of originGermany
Current (A)25 A
Dimensions (LxWxH)42x40x16
FeaturesFast Trench IGBT´sRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
HousingMiniSKiiP II 1
Product lineMiniSKiiP
Product StatusIn Production
TechnologyIGBT
TopologySixpack
TypeMiniSKiiP II 1
VariantSlim lid and Wacker P12
Variant DescriptionThe SKiiP 13AC126V20-M11 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Variant Short DescriptionModule + Slim Pressure Lid + Thermal Paste Wacker P12
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.04 Kilogram
Net weight0.03 Kilogram
Proposition 65Cancer and Reproductive Harm