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Semikron Danfoss Standard Photo MiniSKiiP II 1

25233690M01

SKiiP 12NAB12RAV1-M01

MiniSKiiP II 1, Wacker P12

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originSlovakiaGermany
Current (A)15 A
Voltage (V)1200 V
TopologyCIB
Product lineMiniSKiiP
HousingMiniSKiiP II 1
Dimensions (LxWxH)42x40x16
TechnologyIGBT
Chip technologyRGA
Features1200V RGA IGBTRobust and soft switching freewheeling diodes in CAL technologyNew SKR PEP diode technology for enhanced power and environmental robustnessHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532

General specifications

Characteristic
Value
Gross weight0.04 Kilogram
Net weight0.03 Kilogram

Variant information

Characteristic
Value
VariantWacker P12
Variant DescriptionThe SKiiP 12NAB12RAV1-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a standard silicone-based thermal paste which has been adjusted to the respective module in terms of layer thickness
Variant Short DescriptionModule + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-12nab12rav1-m01-25233690m01">SKiiP 12NAB12RAV1-M01</a><a href="/products/p/skiip-12nab12rav1-m10-25233690m10">SKiiP 12NAB12RAV1-M10</a><a href="/products/p/skiip-12nab12rav1-m15-25233690m15">SKiiP 12NAB12RAV1-M15</a><a href="/products/p/skiip-12nab12rav1-m20-25233690m20">SKiiP 12NAB12RAV1-M20</a><a href="/products/p/skiip-12nab12rav1-m25-25233690m25">SKiiP 12NAB12RAV1-M25</a>