Semikron Danfoss logo

25230040M25

SKiiP 12AC126V1-M25

MiniSKiiP II 1, Standard lid and HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 3 (Trench)
Country of originGermany
Current (A)15 A
Dimensions (LxWxH)42x40x16
FeaturesFast Trench IGBTsRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
HousingMiniSKiiP II 1
Product lineMiniSKiiP
Product StatusIn Production
TechnologyIGBT
TopologySixpack
TypeMiniSKiiP II 1
Typical applicationsInverter up to 10 kVATypical motor power 5.5 kW
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 12AC126V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.04 Kilogram
Net weight0.03 Kilogram
Proposition 65Cancer and Reproductive Harm