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25232790M25

SKiiP 11ACC12T7V1-M25

MiniSKiiP II 1, Standard lid and HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT T7
Country of originGermany
Current (A)10 A
Dimensions (LxWxH)42x40x16
Features1200V Generation 7 IGBTs (T7)Robust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
HousingMiniSKiiP II 1
Product lineMiniSKiiP
Product StatusIn Production New
TechnologyIGBT
TopologyTwelvepack
TypeMiniSKiiP II 1
VariantStandard lid and HPTP
Variant DescriptionThe SKiiP 11ACC12T7V1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
Variant Short DescriptionModule + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.04 Kilogram
Net weight0.03 Kilogram
Proposition 65Cancer and Reproductive Harm