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Semikron Danfoss Standard Photo MiniSKiiP II 1

25230900M01

SKiiP 11AC126V10-M01

MiniSKiiP II 1, Wacker P12

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Product specifications

Characteristic
Value
Product StatusIn Production
Country of originGermany
Current (A)6 A
Voltage (V)1200 V
TopologySixpack
Product lineMiniSKiiP
HousingMiniSKiiP II 1
Dimensions (LxWxH)42x40x16
TechnologyIGBT
Chip technologyIGBT 3 (Trench)
FeaturesFast Trench IGBT´sRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
VariantWacker P12
Variant DescriptionThe SKiiP 11AC126V10-M01 is a 1200 V IGBT module and comes with pre-applied thermal paste Wacker P12 (λ=0.8 W/mK). Wacker P12 is a silicone-based thermal paste with optimized thickness and honeycomb print, enhancing heat dissipation.
Variant Short DescriptionModule + Thermal Paste Wacker P12
Variants<a href="/products/p/skiip-11ac126v10-m00-25230900m00">SKiiP 11AC126V10-M00</a><a href="/products/p/skiip-11ac126v10-m01-25230900m01">SKiiP 11AC126V10-M01</a><a href="/products/p/skiip-11ac126v10-m10-25230900m10">SKiiP 11AC126V10-M10</a><a href="/products/p/skiip-11ac126v10-m11-25230900m11">SKiiP 11AC126V10-M11</a><a href="/products/p/skiip-11ac126v10-m20-25230900m20">SKiiP 11AC126V10-M20</a><a href="/products/p/skiip-11ac126v10-m21-25230900m21">SKiiP 11AC126V10-M21</a>

General specifications

Characteristic
Value
Gross weight0.04 Kilogram
Net weight0.03 Kilogram
Proposition 65Cancer and Reproductive Harm