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25232540M15

SKiiP 03NAC12T4V1-M15

MiniSKiiP II 0, Slim lid and HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 4 (Trench)
Country of originGermany
Current (A)8 A
Dimensions (LxWxH)34x31x16
FeaturesTrench 4 IGBTsRobust and soft switching freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognized: File no. E63532
HousingMiniSKiiP II 0
Product lineMiniSKiiP
Product StatusIn Production
TechnologyIGBT
TopologyCI
TypeMiniSKiiP II 0
VariantSlim lid and HPTP
Variant DescriptionThe SKiiP 03NAC12T4V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + Slim Pressure Lid + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.023 Kilogram
Net weight0.02 Kilogram
Proposition 65Cancer and Reproductive Harm