25230870M15
SKiiP 03NAC126V1-M15
MiniSKiiP II 0, Slim lid and HPTP
25230870M15
Product specifications
Characteristic | Value |
|---|---|
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Germany |
| Current (A) | 8 A |
| Dimensions (LxWxH) | 34x31x16 |
| Features | Fast Trench IGBT´sRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532 |
| Housing | MiniSKiiP II 0 |
| Product line | MiniSKiiP |
| Product Status | In Production |
| Technology | IGBT |
| Topology | CI |
| Type | MiniSKiiP II 0 |
| Variant | Slim lid and HPTP |
| Variant Description | The SKiiP 03NAC126V1-M15 is a 1200 V IGBT module and comes with a 2.8mm height slim pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + Slim Pressure Lid + High Performance Thermal Paste (HPTP) |
| Voltage (V) | 1200 V |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.023 Kilogram |
| Net weight | 0.02 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |