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24921430VM05

SK75MLI07S5TD1E1-M05

SEMITOP E1, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production
Country of originItaly
Current (A)75 A
Voltage (V)650 V
Topology3-Level
Product lineSEMITOP
HousingSEMITOP E1
Dimensions (LxWxH)63x34x12
TechnologyIGBT
Chip technologyTrench 5 (S5)
FeaturesOptimized design for superior thermal performanceLow inductive designPress-Fit contact technology650V Trench5 IGBT (S5/L5)Rapid switching diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typical applicationsUPSSolar
VariantHPTP
Variant DescriptionThe SK75MLI07S5TD1E1-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk75mli07s5td1e1-m05-24921430vm05">SK75MLI07S5TD1E1-M05</a><a href="/products/p/sk75mli07s5td1e1-m07-24921430vm07">SK75MLI07S5TD1E1-M07</a><a href="/products/p/sk75mli07s5td1e1-24921430">SK75MLI07S5TD1E1</a>

General specifications

Characteristic
Value
Gross weight0.022 Kilogram
Net weight0.022 Kilogram
Proposition 65Cancer and Reproductive Harm