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24920850VM05

SK75GD06E3ETE2-M05

SEMITOP E2, HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 3 (Trench)
Country of originItaly
Current (A)75 A
Dimensions (LxWxH)63x57x12
FeaturesOptimized design for superior thermal performanceLow inductive designPress-Fit contact technology650V Trench IGBT3 (E3)Robust and soft switching CAL HD diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
HousingSEMITOP E2
Product lineSEMITOP
Product StatusIn Production
TechnologyIGBT
TopologySixpack
TypeSEMITOP E2
Typical applicationsMotor drivesServo drivesAir conditioningAuxiliary InvertersUPS
VariantHPTP
Voltage (V)650 V

General specifications

Characteristic
Value
Gross weight0.055 Kilogram
Net weight0.035 Kilogram
Proposition 65Cancer and Reproductive Harm