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24919181VM05

SK50GD12T4Tp-M05

SEMITOP 4 Press-Fit, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production
Country of originItaly
Current (A)50 A
Voltage (V)1200 V
TopologySixpack
Product lineSEMITOP
HousingSEMITOP 4 Press-Fit
Dimensions (LxWxH)61x55x12
TechnologyIGBT
Chip technologyIGBT 4 (Trench)
FeaturesOne screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesImproved thermal performances by aluminium oxide substrateTrench4 IGBT technologyCAL4F technology FWDIntegrated NTC temperature sensorUL recognized, file no. E 63 532
Typical applicationsInverter up to 26kVATypical motor power 15kW

General specifications

Characteristic
Value
Gross weight0.074 Kilogram
Net weight0.06 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantHPTP
Variant DescriptionThe SK50GD12T4Tp-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk50gd12t4tp-m05-24919181vm05">SK50GD12T4Tp-M05</a><a href="/products/p/sk50gd12t4tp-24919181">SK50GD12T4Tp</a>