Semikron Danfoss logo

24922560VM07

SK35DGDL12T7ETE2s-M07

SEMITOP E2 Solder, HP-PCM

Product specifications

Characteristic
Value
Chip technologyIGBT T7
Country of originItaly
Current (A)35 A
Dimensions (LxWxH)63x57x12
FeaturesOptimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
HousingSEMITOP E2 Solder
Product lineSEMITOP
Product StatusIn Production New
TechnologyIGBT
TopologyCIB
TypeSEMITOP E2 Solder
Typical applicationsMotor drivesAir conditioningAuxiliary Inverters
VariantHP-PCM
Variant DescriptionThe SK35DGDL12T7ETE2s-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a phase change material and offers superior thermal performance, which maximizes the module's power output or significantly increases its lifetime. The material is solid at room temperature and starts to flow only after very first operation, spread out and fill the gaps between module and cooler.
Variant Short DescriptionModule + High Performance Phase Change Material (HP-PCM)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.055 Kilogram
Net weight0.035 Kilogram
Proposition 65Cancer and Reproductive Harm