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24923290VM07

SK35DGD12T7ETE2s-M07

SEMITOP E2 Solder, HP-PCM

Product specifications

Characteristic
Value
Chip technologyIGBT T7
Country of originItaly
Current (A)35 A
Dimensions (LxWxH)63x57x12
FeaturesOptimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
HousingSEMITOP E2 Solder
Product lineSEMITOP
Product StatusIn Production New
TechnologyIGBT
TopologyCI
TypeSEMITOP E2 Solder
Typical applicationsMotor drivesAir conditioningAuxiliary Inverters
VariantHP-PCM
Variant DescriptionThe SK35DGD12T7ETE2s-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a silicone-free phase change material (PCM) having a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface.
Variant Short DescriptionModule + High Performance Phase Change Material (HP-PCM)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.055 Kilogram
Net weight0.035 Kilogram
Proposition 65Cancer and Reproductive Harm