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24922920VM05

SK25TMLID12F4TE2-M05

SEMITOP E2, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originItaly
Current (A)25 A
Voltage (V)1200 V
Topology3-Level
Product lineSEMITOP
HousingSEMITOP E2
Dimensions (LxWxH)63x57x12
TechnologyIGBT
Chip technologyIGBT 4 Fast (Trench)
FeaturesOptimized design for superior thermal performanceLow inductive designPress-Fit contact technology1200V Trench IGBT4 Fast (F4)650V Trench IGBT3 (E3)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typical applicationsUPSSolar

General specifications

Characteristic
Value
Gross weight0.058 Kilogram
Net weight0.038 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantHPTP
Variant DescriptionThe SK25TMLID12F4TE2-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk25tmlid12f4te2-m05-24922920vm05">SK25TMLID12F4TE2-M05</a><a href="/products/p/sk25tmlid12f4te2-m07-24922920vm07">SK25TMLID12F4TE2-M07</a><a href="/products/p/sk25tmlid12f4te2-24922920">SK25TMLID12F4TE2</a>