Semikron Danfoss logo

24922250VM05

SK25GD12T7ETE1-M05

SEMITOP E1, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originItaly
Current (A)25 A
Voltage (V)1200 V
TopologySixpack
Product lineSEMITOP
HousingSEMITOP E1
Dimensions (LxWxH)63x34x12
TechnologyIGBT
Chip technologyIGBT T7
FeaturesOptimized design for superior thermal performanceLow inductive designPress-Fit contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typical applicationsMotor drivesServo drivesAir conditioningAuxiliary InvertersUPS

General specifications

Characteristic
Value
Gross weight0.022 Kilogram
Net weight0.022 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantHPTP
Variant DescriptionThe SK25GD12T7ETE1-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk25gd12t7ete1-m05-24922250vm05">SK25GD12T7ETE1-M05</a><a href="/products/p/sk25gd12t7ete1-m07-24922250vm07">SK25GD12T7ETE1-M07</a><a href="/products/p/sk25gd12t7ete1-24922250">SK25GD12T7ETE1</a>