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Semikron Danfoss Standard Photo SEMITOP E1 Solder

24922950VM07

SK25DGDL12T7ETE1s-M07

SEMITOP E1 Solder, HP-PCM

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Product specifications

Characteristic
Value
Product StatusIn Production New
Country of originItaly
Current (A)25 A
Voltage (V)1200 V
TopologyCIB
Product lineSEMITOP
HousingSEMITOP E1 Solder
Dimensions (LxWxH)63x34x12
TechnologyIGBT
Chip technologyIGBT T7
FeaturesOptimized design for superior thermal performanceLow inductive designSolder contact technology1200V Generation 7 IGBT (T7)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532
Typical applicationsMotor drivesAir conditioningAuxiliary Inverters

General specifications

Characteristic
Value
Gross weight0.022 Kilogram
Net weight0.022 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
VariantHP-PCM
Variant DescriptionThe SK25DGDL12T7ETE1s-M07 is a 1200 V IGBT module and comes with pre-applied High Performance Phase Change Material (HP-PCM, λ=8.5 W/mK). HP-PCM is a silicone-free phase change material (PCM) having a solid consistency at room temperature. With the application of heat during first operation, the PCM flows to fill gaps and provide a thermal interface.
Variant Short DescriptionModule + High Performance Phase Change Material (HP-PCM)
Variants<a href="/products/p/sk25dgdl12t7ete1s-m05-24922950vm05">SK25DGDL12T7ETE1s-M05</a><a href="/products/p/sk25dgdl12t7ete1s-m07-24922950vm07">SK25DGDL12T7ETE1s-M07</a><a href="/products/p/sk25dgdl12t7ete1s-24922950">SK25DGDL12T7ETE1s</a>