24923270VM05
SK25DGD12T7ETE1s-M05
SEMITOP E1 Solder, HPTP
Product specifications
Characteristic | Value |
|---|---|
| Chip technology | IGBT T7 |
| Country of origin | Italy |
| Current (A) | 25 A |
| Dimensions (LxWxH) | 63x34x12 |
| Features | 1200V Generation 7 IGBT (T7)Integrated NTC temperature sensorPEP rectifier diode technology for enhanced power and environmental robustnessLow inductive designSolder contact technologyRobust and soft switching CAL4F diode technologyUL recognized file no. E 63 532Optimized design for superior thermal performance |
| Housing | SEMITOP E1 Solder |
| Product line | SEMITOP |
| Product Status | In Production New |
| Technology | IGBT |
| Topology | CI |
| Type | SEMITOP E1 Solder |
| Typical applications | Air conditioningMotor drivesAuxiliary Inverters |
| Variant | HPTP |
| Voltage (V) | 1200 V |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.022 Kilogram |
| Net weight | 0.022 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |