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24919781VM05

SK25DGD12T4Tp-M05

SEMITOP 4 Press-Fit, HPTP

Product specifications

Characteristic
Value
Chip technologyIGBT 4 (Trench)
Country of originItaly
Current (A)25 A
Dimensions (LxWxH)61x55x12
FeaturesOne screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesImproved thermal performances by aluminium oxide substrateTrench4 IGBT technologyCAL4F technology FWDIntegrated NTC temperature sensorUL recognized, file no. E 63 532
HousingSEMITOP 4 Press-Fit
Product lineSEMITOP
Product StatusIn Production
TechnologyIGBT
TopologyCI
TypeSEMITOP 4 Press-Fit
Typical applicationsMotor drives
VariantHPTP
Variant DescriptionThe SK25DGD12T4Tp-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.074 Kilogram
Net weight0.06 Kilogram
Proposition 65Cancer and Reproductive Harm