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24921590VM05

SK150MLI07S5TD1E2-M05

SEMITOP E2, HPTP

Product specifications

Characteristic
Value
Chip technologyTrench 5 (S5)
Country of originItaly
Current (A)150 A
Dimensions (LxWxH)63x57x12
FeaturesOptimized design for superior thermal performanceLow inductive designPress-Fit contact technologySplit IGBT gates for optimized driving650V Trench5 IGBT (S5/L5)Rapid switching diode technologyIntegrated NTC temperature sensorUL recognized file no. E 63 532
HousingSEMITOP E2
Product lineSEMITOP
Product StatusIn Production
TechnologyIGBT
Topology3-Level
TypeSEMITOP E2
Typical applicationsUPSSolar
VariantHPTP
Variant DescriptionThe SK150MLI07S5TD1E2-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Voltage (V)650 V

General specifications

Characteristic
Value
Gross weight0.058 Kilogram
Net weight0.038 Kilogram
Proposition 65Cancer and Reproductive Harm