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24920071VM05

SK150MLI07F3TD1p-M05

SEMITOP 4 Press-Fit

Product specifications

Characteristic
Value
Chip technologyIGBT 3 (Trench)
Current (A)150 A
Dimensions (LxWxH)61x55x12
FeaturesRapid switching clamping diode technologyIntegrated NTC temperature sensorOne screw mounting moduleImproved thermal performances by aluminium oxide substrateFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesUL recognized, file no. E 63 532650V Trench IGBT technologyCAL4F technology FWDSolder free mounting with Press-Fit terminals
HousingSEMITOP 4 Press-Fit
Product StatusIn Production
Product lineSEMITOP
TechnologyIGBT
Topology3-Level
TypeSEMITOP 4 Press-Fit
Typical applicationsSolarUPS
Voltage (V)650 V

General specifications

Characteristic
Value
Proposition 65Cancer and Reproductive Harm