24922700VM05
SK10DGDL07E3ETE1-M05
SEMITOP E1, HPTP
24922700VM05
Product specifications
Characteristic | Value |
|---|---|
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Italy |
| Current (A) | 10 A |
| Dimensions (LxWxH) | 63x34x12 |
| Features | Optimized design for superior thermal performanceLow inductive designPress-Fit contact technology650V Trench IGBT3 (E3)Robust and soft switching CAL4F diode technologyPEP rectifier diode technology for enhanced power and environmental robustnessIntegrated NTC temperature sensorUL recognized file no. E 63 532 |
| Housing | SEMITOP E1 |
| Product line | SEMITOP |
| Product Status | In Production |
| Technology | IGBT |
| Topology | CIB |
| Type | SEMITOP E1 |
| Typical applications | Motor drivesAir conditioningAuxiliary Inverters |
| Variant | HPTP |
| Variant Description | The SK10DGDL07E3ETE1-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + High Performance Thermal Paste (HPTP) |
| Voltage (V) | 650 V |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.022 Kilogram |
| Net weight | 0.022 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |