24919191VM05
SK100MLI07F3TD1p-M05
SEMITOP 4 Press-Fit, HPTP
24919191VM05
Product specifications
Characteristic | Value |
|---|---|
| Chip technology | IGBT 3 (Trench) |
| Country of origin | Italy |
| Current (A) | 100 A |
| Dimensions (LxWxH) | 61x55x12 |
| Features | One screw mounting moduleSolder free mounting with Press-Fit terminalsFully compatible with other SEMITOP<sup>®</sup> Press-Fit typesImproved thermal performances by aluminum oxide substrate650V Trench IGBT technologyCAL4F technology FWDRapid switching clamping diode technologyIntegrated NTC temperature sensorUL recognized, file no. E 63 532 |
| Housing | SEMITOP 4 Press-Fit |
| Product line | SEMITOP |
| Product Status | In Production |
| Technology | IGBT |
| Topology | 3-Level |
| Typical applications | UPSSolar |
| Variant | HPTP |
| Variant Description | The SK100MLI07F3TD1p-M05 is a 650 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Variant Short Description | Module + High Performance Thermal Paste (HPTP) |
| Voltage (V) | 650 V |
General specifications
Characteristic | Value |
|---|---|
| Gross weight | 0.074 Kilogram |
| Net weight | 0.06 Kilogram |
| Proposition 65 | Cancer and Reproductive Harm |