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24910820VM05

SK 55 DGL 126-M05

SEMITOP 3, HPTP

Product specifications

Characteristic
Value
Country of originItaly
Current (A)55 A
Dimensions (LxWxH)55x31x12
FeaturesCompact designOne screw mountingHeat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL Technology FWD
HousingSEMITOP 3
Product lineSEMITOP
Product StatusIn Production
Surge current (A)370 A
TechnologyBridge
TopologyRectifier
Typical applicationsRectifier
VariantHPTP
Variant DescriptionThe SK 55 DGL 126-M05 is a 1200 V Bridge module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Voltage (V)1200 V

General specifications

Characteristic
Value
Gross weight0.039 Kilogram
Net weight0.03 Kilogram
Proposition 65Cancer and Reproductive Harm