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24914400VM05

SK 30 MLI 066-M05

SEMITOP 3, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production
Country of originItaly
Current (A)30 A
Voltage (V)600 V
Topology3-Level
Product lineSEMITOP
HousingSEMITOP 3
Dimensions (LxWxH)55x31x12
TechnologyIGBT
Chip technologyIGBT 3 (Trench)
FeaturesCompact designOne screw mountingHeat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL technology FWD
Typical applications3 Level InverterUPS
VariantHPTP
Variant DescriptionThe SK 30 MLI 066-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk-30-mli-066-m01-24914400vm01">SK 30 MLI 066-M01</a><a href="/products/p/sk-30-mli-066-m05-24914400vm05">SK 30 MLI 066-M05</a><a href="/products/p/sk-30-mli-066-24914400">SK 30 MLI 066</a>

General specifications

Characteristic
Value
Gross weight0.039 Kilogram
Net weight0.03 Kilogram
Proposition 65Cancer and Reproductive Harm