Semikron Danfoss logo

24914960VM05

SK 30 GD 066 ET-M05

SEMITOP 3, HPTP

Product specifications

Characteristic
Value
Product StatusIn Production
Country of originItaly
Current (A)30 A
Voltage (V)600 V
TopologySixpack
Product lineSEMITOP
HousingSEMITOP 3
Dimensions (LxWxH)55x31x12
TechnologyIGBT
Chip technologyIGBT 3 (Trench)
FeaturesCompact designOne screw mountingHeat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL technology FWDIntegrated NTC temperature sensor
Typical applicationsInverter up to 10kVATyp. Motor power 4kW
VariantHPTP

General specifications

Characteristic
Value
Gross weight0.039 Kilogram
Net weight0.03 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

Characteristic
Value
Variant DescriptionThe SK 30 GD 066 ET-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
Variant Short DescriptionModule + High Performance Thermal Paste (HPTP)
Variants<a href="/products/p/sk-30-gd-066-et-m05-24914960vm05">SK 30 GD 066 ET-M05</a>