SKiiP IPM by Product Line
The SKiiP technology combines IGBT or SiC modules, gate drive for safe signal insulation, ultra-precise current and voltage sensors, and an efficient heatsink, in one, perfectly matched setup. The SKiiP IGBT IPM 1200V and 1700V product lines set a benchmark for high-performance and robust inverter designs. SKiiP 3 has propagated widely through the industrial drive segment and SKiiP 7 is a new generation based on the actual IGBT/Diode chip generation and driver components. With its six-pack and half-bridge topologies, it covers a current range from 500A up to 2400A. The SKiiP 4, available in a half-bridge topology, has been optimized for the highest power cycling requirements and covers the higher power range up to 3600A.
The SKiiP 4 SiC, available in half-bridge and multi-phase topology, provides convenient and safest possible access to high-performance SiC power-electronics for fast-switching applications with Vdc up to 1500V.
SKiiP®3
SKiiP 3 features high power densities combined with flexible cooling options, such as air and liquid cooling along with customized heat sinks. Reliable driver technology, integrated current sensors, and comprehensive protection functions complete the IPM design.
SKiiP 3 is widely proliferated in the industrial drive segment. With its sixpack and half-bridge topologies, it covers a current range from 500A up to 2400A.
SKiiP®4
With its power range up to 3600A, SKiiP 4 is the most powerful intelligent power module on the market. Thanks to silver sintering and high-performance cooler technology SKiiP 4 increases reliability for demanding power cycling conditions. Our Sinter Technology enhances resilience to both active and passive thermal cycling, ultimately leading to an extended operational lifetime compared to conventional solder approaches.
SKiiP 4 is available in half-bridge topology, variable number of the power modules on the heat sink is possible. Integrated digital driver reduces design complexity and costly components and provides safe isolation for both switching signals and parameter measurement. In addition to a high reliability design, SKiiP 4 drivers also include CAN-bus functionality.
SKiiP®7
SKiiP 7 offers all the advantages of intelligent power modules known from previous SKiiP generations. It comes with a standard or customized air-cooled or water-cooled heat sink. The simple design and wide power range combined with high reliability in power cycling and environmental stress, a digital driver and ASIC advantages as well as the latest IGBT7 generation enable customers to design converters with higher power ratings using the same or less volume at a lower cost per unit area.
Thanks to its modular design and the availability of both six-pack and half-bridge configurations with a variable number of power modules on one heat sink, the power range is extremely wide: from 150kW to 2MW. The IPM comes fully functional, electric and burn-in tested.SKiiP®4 SiC
With a power range of up to 2400A, the SKiiP 4 SiC offers a highly convenient and secure solution for high-power converter designs utilizing SiC technology. The proven high-performance and reliable assembly techniques employed in SKiiP 4—including silver sintering, baseplate-free construction, and advanced cooling systems—create an optimal environment for maximising the potential of SiC MOSFET devices. The integrated gate-driver is specifically engineered to suit the MOSFET technology and topology of the SKiiP, ensuring safe and stable operation across the entire operational spectrum. Furthermore, the driver architecture is designed to support the continual advancements in SiC technology, minimizing impact on system design.
SKiiP 4 SiC can be configured in half-bridge and multi-phase topologies, allowing for flexible combinations of power modules mounted on the heat sink. The digital driver interface, inherited from SKiiP4 IGBT including its CAN-bus capability, enables seamless selection between IGBT or SiC-based SKiiPs without requiring modifications to the overall system architecture.