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25241220M25

SKiiP39GB12VV1-M25

MiniSKiiP II 3, Standard lid and HPTP

产品规格

特性
值
产品状态In Production New
原产地Slovakia
电流400 A
电压1200 V
拓扑Half-Bridge
产品线MiniSKiiP
外壳MiniSKiiP II 3
尺寸82x59x16
技术IGBT
芯片技术V-IGBT
FeaturesRobust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532

一般规格

特性
值
毛重0.098 千克
净重0.08 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
值
Variants<a href="/zh-cn/products/p/skiip39gb12vv1-m20-25241220m20">SKiiP39GB12VV1-M20</a><a href="/zh-cn/products/p/skiip39gb12vv1-m21-25241220m21">SKiiP39GB12VV1-M21</a><a href="/zh-cn/products/p/skiip39gb12vv1-m25-25241220m25">SKiiP39GB12VV1-M25</a>
产品变体介绍The SKiiP39GB12VV1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.
产品变体简要介绍Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP)
变体Standard lid and HPTP