Semikron Danfoss logo

25241220M25

SKiiP39GB12VV1-M25

MiniSKiiP II 3, Standard lid and HPTP

产品规格

特性
产品状态In Production New
原产地Germany
电流400 A
电压1200 V
拓扑Half-Bridge
产品线MiniSKiiP
外壳MiniSKiiP II 3
尺寸82x59x16
技术IGBT
芯片技术V-IGBT
特性Robust and soft freewheeling diodes in CAL technologyHighly reliable spring contacts for electrical connectionsUL recognised file no. E63532
变体Standard lid and HPTP

一般规格

特性
毛重0.098 千克
净重0.08 千克
Proposition 65Cancer and Reproductive Harm

Variant information

特性
Variants<a href="/products/p/skiip39gb12vv1-m20-25241220m20">SKiiP39GB12VV1-M20</a><a href="/products/p/skiip39gb12vv1-m21-25241220m21">SKiiP39GB12VV1-M21</a><a href="/products/p/skiip39gb12vv1-m25-25241220m25">SKiiP39GB12VV1-M25</a>
产品变体介绍The SKiiP39GB12VV1-M25 is a 1200 V IGBT module and comes with a 6.5mm height standard pressure lid and pre-applied High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP provides top-tier thermal performance with optimized filler content.
产品变体简要介绍Module + Standard Pressure Lid + High Performance Thermal Paste (HPTP)