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24914400VM05

SK 30 MLI 066-M05

SEMITOP 3, HPTP

製品仕様

特徴
値
製品の状態In Production
原産国Italy
電流 (A)30 A
電圧 (V)600 V
トポロジー3-Level
製品ラインSEMITOP
ハウジングSEMITOP 3
寸法55x31x12
技術IGBT
チップ技術IGBT 3 (Trench)
FeaturesCompact designOne screw mountingHeat transfer and isolation through direct copper bonded aluminium oxide ceramic (DCB)Trench IGBT technologyCAL technology FWD
代表的なアプリケーション3 Level InverterUPS

一般仕様

特徴
値
総重量0.039 Kilogram
正味重量0.03 Kilogram
Proposition 65Cancer and Reproductive Harm

Variant information

特徴
値
Variants<a href="/ja-jp/products/p/sk-30-mli-066-m01-24914400vm01">SK 30 MLI 066-M01</a><a href="/ja-jp/products/p/sk-30-mli-066-m05-24914400vm05">SK 30 MLI 066-M05</a><a href="/ja-jp/products/p/sk-30-mli-066-24914400">SK 30 MLI 066</a>
バリアントHPTP
分類の簡単な説明Module + High Performance Thermal Paste (HPTP)
分類の説明The SK 30 MLI 066-M05 is a 600 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime.