23930350M05
SKiM609GAR12E4-M05
SKIM 93, HPTP
23930350M05
Produktdaten
Eigenschaften | Wert |
|---|---|
| Abmessungen (LxBxH) | 160x150x35 |
| Chip Technologie | IGBT 4 (Trench) |
| Eigenschaften | IGBT 4 Trench Gate TechnologySolderless sinter technologyV<sub>CE(sat)</sub> with positive temperature coefficientLow inductance caseInsulated by Al<sub>2</sub>O<sub>3</sub> DBC (Direct Bonded Copper) ceramic substratePressure contact technology for thermal contactsSpring contact system to attach driver PCB to the control terminalsHigh short circuit capability, self limiting to 6 x I<sub>C</sub>Integrated temperature sensor |
| Gehäuse | SKIM 93 |
| Herkunftsland | Germany |
| Produktlinie | SKiM 93 |
| Produktstatus | In Production New |
| Spannung | 1200 V |
| Stromstärke (A) | 600 A |
| Technologie | IGBT |
| Topologie | Chopper/Booster |
| Typ | SKIM 93 |
| Typische Anwendungsgebiete | Automotive inverterHigh reliability AC inverter windHigh reliability AC inverter drives |
| Variante | HPTP |
| Varianten Beschreibung | The SKiM609GAR12E4-M05 is a 1200 V IGBT module and comes with High Performance Thermal Paste (HPTP, λ=2.5 W/mK). HPTP is a silicone-based thermal paste that offers outstanding thermal performance and maximizes the module's output power or significantly increases the module lifetime. |
| Varianten Kurzbeschreibung | Module + High Performance Thermal Paste (HPTP) |
Allgemeine Spezifikationen
Eigenschaften | Wert |
|---|---|
| Bruttogewicht | 1.2 Kilogramm |
| Nettogewicht | 1.1 Kilogramm |
| Proposition 65 | Cancer and Reproductive Harm |